One Component, Dual Cure Epoxy for Medical Applications

 
 
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Update 2026-03-27 10:03
 
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UV15DC80-1Med

Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations of traditional UV adhesives by effectively curing shadowed areas that wouldn't receive sufficient UV exposure, making it suitable for intricate parts and complex geometries. Notably, the adhesive meets ISO 10993-5 cytotoxicity standards, demonstrating biocompatibility for medical device applications.

Key Features

Allows for curing in “shadowed out” areas

Cures at temperatures as low as 80°C

Convenient no mix system

Excellent physical strength properties


Typical Properties
Viscosity
20,000-40,000 cps
Cure Schedule
Cure at 80°C for 40-60 minutes; Additional post curing at 80°C for 2-4 hours or 125°C for 30-60 minutes
Hardness
>70 Shore D
Service Temperature Range
-80°F to +350°F
Dielectric Constant
3.49
Refractive Index
1.52


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